集成電力電子模塊（IPEM）綜述

摘要：用非標準件制造電力電子產品，導致生產勞動強度大、成本高、可靠性差等問題。為了解決這些問題，并進一步顯著改善電力電子系統的性能，有必要應用“集成電力電子模塊”（IPEM）技術，開發一種電力電子系統集成方法。要實現電力電子系統的高度集成，需要更好的封裝技術，以提高其功率密度、改善性能和散熱條件。此外，也需要將“分析和設計”軟件集成，使集成技術有突破性的發展，并且使材料的物理性質得以充分利用。 敘詞：集成電力電子模塊 系統集成 電力電子集成塊 封裝技術 Abstract：In order to provide future significant improvements in performances of power electronic systems to overcome problems of using non-standard parts in manufacturing proccess,resulting in labor intensive production,increased cost,and poor reliability,it is essential to develop an integrated power electronic system approach in the form of IPEMs.Moving to a highly integrated system requires better packaging techniques to increase power density,improve performance and thermal management.Moreover,integrated analysis and design tools are necessary to develop breakthrough integration techniques that fully exploit the physical properties of available materials. Keyword：integrated power electronics module(IPEM) system integration power electronics building block(PEBB) packaging techniques